Enclosure for Antmicro baseboard with NVIDIA Jetson AGX Thor

Copyright (c) 2026 Antmicro

Overview

This project contains open hardware design files for a CNC-milled enclosure that matches the Antmicro baseboard for NVIDIA Jetson AGX Thor (T5000) System on Module. This black-anodized aluminum enclosure ensures optimal thermal performance when used with DC blower fans. The enclosure supports pass-through ventilation with air flowing through the enclosure's internal structure. This allows the use of the enclosure in a stacked assembly (for instance in rack cabinets) or in space-constrained applications. When installed in a 19" rack cabinet, it is possible to fit up to 8 units in a single row, which uses 2.5U of the vertical space. The enclosure includes VESA mounting holes and a 1/4" - 20 UNC threaded slot compatible with tripods and other photographic accessories.

The CNC-milled part files are optimized for compatibility with the popular 3-axis CNC machining process.

You can learn more about the Antmicro Baseboard for NVIDIA Jetson Thor from this blog article.

Mechanical outline

The mechanical outline along with the overall dimensions is presented in the graphics below.

Thermal performance

The thermal performance of the enclosure was analyzed with Antmicro Open source thermal simulation and analysis methodology expanded with CFD (Computational Fluid Dynamics) capabilities.

Mechanical bodies and materials used in the simulation

• Aluminum Enclosure for Antmicro baseboard with NVIDIA Jetson AGX Thor
• Copper Heatsink
• Aluminum TTP (Thermal Transfer Plate) for NVIDIA Jetson AGX Thor SoM
• 3D printed shroud which directs the air flow inside the enclosure
• Simplified model of the Antmicro Baseboard for NVIDIA Jetson AGX Thor
• 2x blower fan - Sunon EF50151BX-1B000-A99

Simulation constraints

• Ambient temperature of 23°C (73.4°F)
• 130W heat source applied to the NVIDIA Jetson AGX Thor SoM TTP facing the copper heatsink
• Source of the air flow rated with respect to the performance curve derived from the fan datasheet

Simulation results

The simulated peak temperature was 74°C (165.2°F) obtained at a spot between the NVIDIA Jetson AGX Thor SoM TTP and the copper heatsink.

The simulation confirms that the designed thermal solution meets the thermal management requirements specified in the NVIDIA Jetson Thor Series Modules Thermal Design Guide.

Project structure

The project files are stored in the following directories:

• step - contains STEP files of the 3d-printable, CNC-manufacturable parts and additional (i.e. off-the-shelf) components and fastening parts needed to assemble the enclosure
• blend - contains .blend files derived from the STEP files
• drawings - contains mechanical drawings of the CNC-manufacturable parts in PDF format
• img - contains graphics for this README
• bom - contains the bill of materials

Licensing

This project is published under the Apache-2.0 license.